Double-sided friction stir welding of Nitronic-40 stainless steel for application in tokamak devices Supreeth Gaddam, Ravi Sankar Haridas, Deepthi Tammana, Charlie Sanabria, Christopher J. Lammi, Diana Berman, & Rajiv S. Mishra
Effect of milling time and sintering temperature on the microstructure and binder distribution of spark plasma sintered NbC-Ni cermets Supreeth Gaddam, Amit Kishan Behera, Noriaki Arai, Qiaofu Zhang, & Rajiv S. Mishra
A Novel Approach for Enhanced Mechanical Properties in Solid-State Additive Manufacturing by Additive Friction Stir Deposition Using Thermally Stable Al-Ce-Mg Alloy Anurag Gumaste, Abhijeet Dhal, Priyanshi Agrawal, Ravi Sankar Haridas, Vijay K. Vasudevan, David Weiss, & Rajiv S. Mishra
SolidStir Additive Manufacturing: A Novel Deformation-Based Additive Manufacturing Using Friction Stir Technology Ravi Sankar Haridas, Anurag Gumaste, Pranshul Varshney, Bodhi Ravindran Manu, Kumar Kandasamy, Nilesh Kumar & Rajiv S. Mishra
Solid Stir Extrusion: Innovating friction stir technology for continuous extrusion process Anurag Gumaste, Ravi Sankar Haridas, Sanya Gupta, Supreeth Gaddam, Kumar Kandasamy, Brandon A. McWilliams, Kyu C. Cho & Rajiv S. Mishra
Evolution of microstructure and mechanical properties in gas tungsten arc welded dual-phase Fe50Mn30Co10Cr10 high entropy alloy J. G. Lopes, Priyanka Agrawal, Jiajia Shen, N. Schell, Rajiv S. Mishra, & J. P. Oliveira
Microstructural engineering through high enthalpy states: implications for far-from-equilibrium processing of structural alloys Rajiv S. Mishra & Sanya Gupta
Favorable property integration in high entropy alloys via dissimilar friction stir welding: A case study using Al0.3CoCrFeNi and Fe38.5Co20Mn20Cr15Si5Cu1.5 HEAs Ravi Sankar Haridas, Anurag Gumaste, Priyanshi Agrawal, Surekha Yadav & Rajiv S. Mishra
Microstructure evolution and mechanical properties in a gas tungsten arc welded Fe42Mn28Co10Cr15Si5 metastable high entropy alloy Jiajia Shen, Priyanka Agrawal, Tiago A. Rodrigues, J. G. Lopes, N. Schell, Jingjing He, Zhi Zeng, Rajiv S. Mishra, J. P. Oliveira
